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📝 Update publication list (#274)
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Drewniok committed Sep 5, 2023
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6 changes: 4 additions & 2 deletions docs/publications.rst
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Expand Up @@ -93,7 +93,8 @@ Furthermore, if you use any of the design automation algorithms, please consider
@inproceedings{drewniok2023quicksimIEEE,
title={{\emph{QuickSim}: Efficient \emph{and} Accurate Physical Simulation of Silicon Dangling Bond Logic}},
author={Drewniok, Jan and Walter, Marcel and Ng, Samuel Sze Hang and Walus, Konrad and Wille, Robert},
booktitle={IEEE International Conference on Nanotechnology (IEEE NANO)},
booktitle={2023 IEEE 23rd International Conference on Nanotechnology (NANO)},
pages={817-822},
year={2023}
}

Expand All @@ -104,7 +105,8 @@ Furthermore, if you use any of the design automation algorithms, please consider
@inproceedings{drewniok2023temperatureIEEE,
title={{Temperature Behavior of Silicon Dangling Bond Logic}},
author={Drewniok, Jan and Walter, Marcel and Wille, Robert},
booktitle={IEEE International Conference on Nanotechnology (IEEE NANO)},
booktitle={2023 IEEE 23rd International Conference on Nanotechnology (NANO)},
pages={925-930},
year={2023}
}

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Expand Up @@ -444,8 +444,9 @@ class critical_temperature_impl
/**
*
* This algorithm performs temperature-aware SiDB simulation as proposed in \"Temperature Behavior of Silicon Dangling
* Bond Logic\" by J. Drewniok, M. Walter, and R. Wille in IEEE NANO 2023. It comes in two flavors: gate-based and
* non-gate based, which can be specified using the `critical_temperature_mode` parameter.
* Bond Logic\" by J. Drewniok, M. Walter, and R. Wille in IEEE NANO 2023
* (https://ieeexplore.ieee.org/document/10231259). It comes in two flavors: gate-based and non-gate based, which can be
* specified using the `critical_temperature_mode` parameter.
*
* For gate-based simulation, the Critical Temperature is defined as follows: The temperature at which the excited
* charge distributions are populated by more than \f$ 1 - \eta \f$, where \f$ \eta \in [0,1] \f$.
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9 changes: 5 additions & 4 deletions include/fiction/algorithms/simulation/sidb/quicksim.hpp
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Expand Up @@ -51,10 +51,11 @@ struct quicksim_params

/**
* The *QuickSim* algorithm which was proposed in \"QuickSim: Efficient and Accurate Physical Simulation of Silicon
* Dangling Bond Logic\" by J. Drewniok, M. Walter, S. S. H. Ng, K. Walus, and R. Wille in IEEE NANO 2023 is an
* electrostatic ground state simulation algorithm for SiDB layouts. It determines physically valid charge
* configurations (with minimal energy) of a given (already initialized) charge distribution layout. Depending on the
* simulation parameters, the ground state is found with a certain probability after one run.
* Dangling Bond Logic\" by J. Drewniok, M. Walter, S. S. H. Ng, K. Walus, and R. Wille in IEEE NANO 2023
* (https://ieeexplore.ieee.org/document/10231266) is an electrostatic ground state simulation algorithm for SiDB
* layouts. It determines physically valid charge configurations (with minimal energy) of a given (already initialized)
* charge distribution layout. Depending on the simulation parameters, the ground state is found with a certain
* probability after one run.
*
* @tparam Lyt Cell-level layout type.
* @param lyt The layout to simulate.
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